发明名称 FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
摘要 The present invention relates to a flexible printed circuit board and a manufacturing method thereof, which can implement low resistance characteristics and can simply and easily perform processes, thereby reducing manufacturing costs and enhancing productivity. The manufacturing method of the flexible printed circuit board comprises the steps of: forming a deposition seed layer on a prepared substrate; forming, on the deposition seed layer, a circuit cover layer having a circuit pattern groove in a shape of a circuit pattern; forming a circuit plating layer in the circuit pattern groove by plating the circuit cover layer; and forming the circuit pattern by etching the circuit plating layer.
申请公布号 KR20160046774(A) 申请公布日期 2016.04.29
申请号 KR20160045609 申请日期 2016.04.14
申请人 AMOGREENTECH CO., LTD. 发明人 KIM, JONG SOO;YU, JEONG SANG;KWON, O CHUNG;DAN, SUNG BAEK
分类号 H05K3/42;H05K3/06;H05K3/28;H05K3/46 主分类号 H05K3/42
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