发明名称 |
METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE THEREFOR |
摘要 |
A semiconductor component having wetable leadframe lead surfaces and a method of manufacture. A leadframe having leadframe leads is embedded in a mold compound. A portion of at least one leadframe lead is exposed and an electrically conductive material is formed on the exposed portion. The mold compound is separated to form singulated semiconductor components. |
申请公布号 |
HK1146764(A1) |
申请公布日期 |
2016.04.29 |
申请号 |
HK20110100369 |
申请日期 |
2011.01.14 |
申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES LLC |
发明人 |
PHILLIP CELAYA P;JAMES P. LETTERMAN JR. JP;ROBERT L. MARQUIS RL |
分类号 |
H01L |
主分类号 |
H01L |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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