SOLDER BALL MOUNTING METHOD FOR LIGHT EMITTING DEVICE, WAFER FOR LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE

摘要

The present invention relates to a solder ball bonding method for a light emitting device, a wafer for the light emitting device, and the light emitting device which can be used for display or lighting. The method includes: a flux providing step of providing flux on an electrode formed on a wafer body for the light emitting device; a mask disposing step of disposing a mask for a solder ball injection on the wafer body for the light emitting device so as to allow a solder ball to be settled on the flux; a solder ball injecting step of injecting the solder ball so as to allow the solder ball to be settled on the flux by using the mask; a mask removing step of removing the mask; and a reflow step of performing reflow so as to allow the solder ball to be bonded to the electrode.