| 摘要 |
The purpose of the present invention is to provide a wafer processing method which makes debris not to adhere to the surface of a device. The debris is generated along with lines for division when laser beams are irradiated along with the lines for division on a wafer having devices formed by a stacked functional layer on the surface of a substrate. The present invention is a wafer processing method which divides a wafer having a plurality of devices formed by a stacked functional layer on the surface of a substrate along with a plurality of streets which divides the devices. The method comprises: a protection tape adhesion process which faces a side of an adhesive layer of the protection tape having an adhesive layer with the surface of the functional layer of the wafer, thereby adhering the protection tape to the surface of the functional layer; a wafer division process which holds the side of the protection tape of the wafer passed through the protection tape adhesion process on a holding surface of a chuck table, irradiates laser beams, having absorbent waves for the substrate and the functional layer, along with the lines for division from the back surface of the substrate of the wafer, and forms a laser processing groove reaching to the protection tape along with the lines for division, thereby dividing the wafer into individual device chips. In the protection tape adhesion process, the adhesive layer of the protection tape is adhered to the device in order to have no gap, such that the debris does not adhere to the surface of a device when laser beams are irradiated along with the lines for division in the wafer division process. |
