According to a technical concept of the present invention, a semiconductor package comprises: a semiconductor chip having an active surface and a non-active surface; a ground member existing on the active surface of the semiconductor chip; and an electromagnetic shielding member passing through the semiconductor chip to be electrically connected to the ground member, and covering at least a portion of the non-active surface of the semiconductor chip. Therefore, the semiconductor package has an electromagnetic shielding structure with superior electromagnetic inference characteristics.
