| 摘要 |
A WATER JET HANDLER (200) HAS A LOADING LOCATION (205), A CUTTING LOCATION (210), AND AN UNLOADING LOCATION (215); AND TWO MOVABLE MOUNTS (240 AND 245). AS A FIRST MOVABLE MOUNT (240) RECEIVES A MOLDED SUBSTRATE AT THE LOADING LOCATION (205), AND TRANSPORTS IT TO THE CUTTING LOCATION (210), A SECOND MOVABLE MOUNT (245) TRANSPORTS SINGULATED SEMICONDUCTOR PACKAGES OF A PREVIOUSLY SINGULATED MOLDED SUBSTRATE FROM THE CUTTING LOCATION (210) TO THE UNLOADING LOCATION (215). AS THE MOLDED SUBSTRATE ON THE FIRST MOVABLE MOUNT (240) IS CUT IN THE X DIRECTION (232) BY A WATER JET, THE SINGULATED SEMICONDUCTOR PACKAGES ARE UNLOADED. THE MOLDED SUBSTRATE IS THEN TRANSFERRED TO THE SECOND MOVABLE MOUNT (245) ON WHICH IT IS CUT IN THE Y DIRECTION (272) TO PRODUCE SINGULATED SEMICONDUCTOR PACKAGES, AS THE FIRST MOVABLE MOUNT (240) RETURNS TO THE LOADING LOCATION (205), WHERE ANOTHER MOLDED SUBSTRATE IS LOADED. |
