发明名称 |
Mikroelektromekaaninen laite ja mikroelektromekaanisen laitteen valmistusmenetelmä |
摘要 |
A microelectromechanical device that comprises a wafer plate, a group of one or more wafer connector elements, and an electrical distribution layer between them. For reduced device thickness, the wafer plate comprises at least two dies and bonding material that bonds the at least two dies alongside each other to the longitudinal extent of the wafer plate, wherein at least one of the dies is a microelectromechanical die. The electrical distribution layer covers the wafer plate and includes a layer of dielectric material and a layer of conductive material, wherein the layer of conductive material is patterned within the layer of dielectric material for electrical interconnection of the dies and the wafer connector elements. With the new configuration, significantly reduced MEMS device thicknesses are achieved |
申请公布号 |
FI125959(B) |
申请公布日期 |
2016.04.29 |
申请号 |
FI20130005488 |
申请日期 |
2013.05.10 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
KUISMA, HEIKKI;NURMI, SAMI |
分类号 |
G01L7/08;B81B7/02;H01L25/00;H05K13/00 |
主分类号 |
G01L7/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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