HEAT SINK MODULE APPARATUS

摘要

The present invention relates to a thermoelectric module apparatus. More particularly, the thermoelectric module apparatus includes: a pipe-type housing having a hollow passing therethrough in a longitudinal direction; a thermoelectric module coupled to the housing; and a heat sink coupled to the thermoelectric module. The pipe-type housing extends in a longitudinal direction while having a predetermined width and has a plurality of installing holes arranged in parallel to each other in a circumference direction. The thermoelectric module has a plurality of heat sink plates each having a predetermined width, length and thickness and formed in a plate shape. The housing is connected to one side of the heat sink plate located in a width direction. The heat sink plates are installed into the installing holes, respectively, and disposed such that some of the heat sink plates are inserted into the hollow with a predetermined width to be exposed and others of the heat sink plates protrude toward the outside of the housing with a predetermined width to be exposed, and the housing is connected to the parts exposed toward the outside of the housing.