Thermal Management In Electronic Apparatus With Phase-Change Material And Silicon Heat Sink

摘要

Embodiments of an apparatus with a thermal management technique utilizing a silicon heat sink and/or a phase-change material, as well as an assembling method thereof, are described. In one aspect, the apparatus comprises a main unit, a phase-change material and an enclosure enclosing the main unit and the phase-change material. The main unit comprises a substrate and at least one heat-generating device disposed on the substrate. The phase-change material is in direct contact with each heat-generating device of the at least one heat-generating device to absorb and dissipate heat generated by the at least one heat-generating device.

主权项

1. An apparatus, comprising:
a main unit, comprising:
a substrate, andat least one heat-generating device disposed on the substrate; a thermal management unit, comprising:
a first silicon heat sink coupled to the at least one heat-generating device and comprising a base portion and a fin portion, the fin portion of the first silicon heat sink comprising a plurality of fins protruding from the base portion,a second silicon heat sink comprising a base portion and a fin portion, the fin portion of the second silicon heat sink comprising a plurality of fins protruding from the base portion, anda phase-change material in direct contact with at least the fin portion of the first silicon heat sink and configured to absorb at least a portion of heat that is generated by the at least one heat-generating device and transferred through the first silicon heat sink; and an enclosure enclosing the main unit and the thermal management unit therein, the second silicon heat sink coupled to the enclosure.