发明名称 |
PACKAGE SUBSTRATE AND FLIP-CHIP PACKAGE CIRCUIT INCLUDING THE SAME |
摘要 |
This disclosure provides a package substrate, a flip-chip package circuit and their fabrication method. The package substrate includes: a first wiring layer having a first metal wire and a first dielectric material layer filling the remaining part of the first wiring layer except for the first metal wire; a conductive pillar layer formed on the first wiring layer and including a metal pillar connected to the first metal wire, a molding compound layer with a protrusion part surrounding the metal pillar, and a second dielectric material layer formed on the molding compound layer; a second wiring layer formed on the conductive pillar layer and including a second metal wire connected to the metal pillar; and a protection layer formed on the second wiring layer. |
申请公布号 |
US2016118327(A1) |
申请公布日期 |
2016.04.28 |
申请号 |
US201414521812 |
申请日期 |
2014.10.23 |
申请人 |
PHOENIX PIONEER TECHNOLOGY CO., LTD. |
发明人 |
HSU CHE-WEI;HSU SHIH-PING |
分类号 |
H01L23/498;H01L21/48;H01L21/683;H05K1/18 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
1. A package substrate comprising:
a first wiring layer having a first metal wire and a first dielectric material layer filling the remaining part of the first wiring layer except for the first metal wire; a conductive pillar layer formed on the first wiring layer and including a metal pillar connected to the first metal wire, a molding compound layer with a protrusion part surrounding the metal pillar, and a second dielectric material layer formed on the molding compound layer; a second wiring layer formed on the conductive pillar layer and including a second metal wire connected to the metal pillar; and a protection layer formed on the second wiring layer. |
地址 |
Hsinchu County TW |