| 摘要 |
A mobile electronic part comprising: (i) a shaped metal part, at least part of the surface thereof being coated with at least one polymer layer (L), wherein the metal is selected from a group consisting of magnesium, aluminum and alloys of these metals, and wherein said polymer layer (L) comprises at least one polymer selected from an aromatic polyamide-imide polymer [(PAI) polymer, herein after] or a poly(ethersulfone) polymer [(PESU) polymer herein after], and (ii) a thermoplastic resin composition layer [layer (T), herein after] fixed to the at least one polymer layer (L) of said shaped metal part wherein said composition comprises at least one thermoplastic polymer [polymer (T), herein after]. |
