| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package substrate and a manufacturing method of the same, which achieve a short processing time for forming a cavity in a multilayer substrate, and high dimensional accuracy of the cavity, and high processing depth accuracy.SOLUTION: A semiconductor package substrate manufacturing method comprises the steps of: irradiating laser beams 11 from above a cured resin base material 6 which is exposed from an opening 9 of a multilayer substrate 8 and along an outer edge of a cavity bottom pattern 4 to form slits 12 on which the cavity bottom pattern 4 is exposed, in a revolving manner; and removing by detaching the cured resin base material 6 and an insulating resin base material 1 which are surrounded by the slits 12 from a second copper foil layer 2b together with a first copper foil layer 2a to form the cavity bottom pattern 4 to form in the multilayer substrate 8, a cavity 13 on which the second copper foil layer 2b is exposed.SELECTED DRAWING: Figure 1 |
