CHIP COMPONENT AND MANUFACTURING METHOD THEREOF, CIRCUIT ASSEMBLY INCLUDING THE CHIP COMPONENT, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a chip component capable of improving the adhesion strength of an electrode to a substrate and satisfactorily distinguishing the front from the rear, and a manufacturing method of a chip component.SOLUTION: There is provided a chip component including: a substrate 2 in which an element region 5 and an electrode region 16 are set; an insulating film (a first insulating film 9 and a second insulating film 13) which is formed on the substrate 2 and which selectively includes an internal uneven structure 18 in the electrode region 16 on a surface; a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering a recessed portion 17 of the internal uneven structure 18 and which include an external uneven structure 6, 7 on a surface on the opposite side; and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.SELECTED DRAWING: Figure 14