METHOD OF FABRICATING SEMICONDUCTOR DEVICE

摘要

The method includes disposing semiconductor chips on a package substrate having sawing lines, forming an encapsulant to cover the semiconductor chips on the package substrate, forming a package assembly by a first curing of the encapsulant, forming first grooves by cutting the encapsulant along the sawing lines, performing a second curing of the encapsulant, and dividing the package assembly into unit semiconductor packages by cutting the package substrate along the sawing lines and forming second grooves to overlap the first grooves.

主权项

1. A method of fabricating a semiconductor package, comprising:
disposing semiconductor chips on a package substrate having sawing lines; forming an encapsulant to cover the semiconductor chips on the package substrate; performing a first curing of the encapsulant; forming a package assembly; cutting the encapsulant along the sawing lines; forming first grooves; performing a second curing of the encapsulant; cutting the package substrate along the sawing lines; forming second grooves, the second grooves being overlapped with the first grooves; and dividing the package assembly into unit semiconductor packages.