| 发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A method of manufacturing a semiconductor package includes providing a package substrate, arranging a plurality of semiconductor devices in an array pattern on an upper surface of the package substrate and electrically connecting the plurality of semiconductor devices to the package substrate, and forming a molding member on the upper surface of the package substrate to cover the semiconductor chips. The molding member includes a warpage-preventing portion configured to prevent or reduce a warpage of the package substrate. The warpage-preventing portion may be raised above a top surface of a base portion of the molding member. |
| 申请公布号 |
US2016118273(A1) |
申请公布日期 |
2016.04.28 |
| 申请号 |
US201514824079 |
申请日期 |
2015.08.12 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
CHO Yun-Hee;KIM Young-Bae |
| 分类号 |
H01L21/56;H01L21/78 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a semiconductor package, the method comprising:
providing a package substrate; arranging a plurality of semiconductor devices in an array pattern on an upper surface of the package substrate; electrically connecting the plurality of semiconductor devices to the package substrate; and forming a molding member on the upper surface of the package substrate to cover the semiconductor chips, the molding member including a warpage-preventing portion configured to prevent or reduce a warpage of the package substrate, wherein the warpage-preventing portion is raised above a top surface of a base portion of the molding member. |
| 地址 |
Suwon-si KR |
