发明名称 PLATING CUP WITH CONTOURED CUP BOTTOM
摘要 Disclosed herein are cups for engaging wafers during electroplating in clamshell assemblies and supplying electrical current to the wafers during electroplating. The cup can comprise an elastomeric seal disposed on the cup and configured to engage the wafer during electroplating, where upon engagement the elastomeric seal substantially excludes plating solution from a peripheral region of the wafer, and where the elastomeric seal and the cup are annular in shape, and comprise one or more contact elements for supplying electrical current to the wafer during electroplating, the one or more contact elements attached to and extending inwardly towards a center of the cup from a metal strip disposed over the elastomeric seal. A notch area of the cup can have a protrusion or an insulated portion on a portion of a bottom surface of the cup where the notch area is aligned with a notch in the wafer.
申请公布号 US2016115615(A1) 申请公布日期 2016.04.28
申请号 US201614990573 申请日期 2016.01.07
申请人 NOVELLUS SYSTEMS, INC. 发明人 He Zhian;Feng Jingbin;Ghongadi Shantinath;Wilmot Frederick D.
分类号 C25D17/06;C25D7/12;C25D17/00 主分类号 C25D17/06
代理机构 代理人
主权项 1. A cup for engaging a wafer during electroplating in a clamshell assembly and supplying electrical current to the wafer during electroplating, the cup comprising: an elastomeric seal disposed on the cup and configured to engage the wafer at an inner edge of the elastomeric seal during electroplating, wherein upon engagement the elastomeric seal substantially excludes plating solution from a peripheral region of the wafer, wherein the elastomeric seal and the cup are annular in shape; a plurality of contact elements for supplying electrical current to the wafer during electroplating, each of the contact elements attached to and extending inwardly towards a center of the cup from a metal strip disposed over the elastomeric seal; and wherein each of the contact elements in a notch area of the cup is longer than each of the contact elements in a non-notch area of the cup by an amount so that an electric potential at an interface with the plating solution in the notch area is substantially the same as an electric potential at the interface with the plating solution in the non-notch area, wherein the notch area corresponds to an area of the cup in which the distance from the center of the wafer to the edge of the elastomeric seal is less than in non-notch areas of the cup.
地址 Fremont CA US