| 摘要 |
When forming a scribe line at the position right above and right below a sealant, a scribing apparatus of the present invention can smoothly form a crack with the sufficient depth on a substrate along the entire length of the scribe line. A scribing method of the present invention comprises the steps of: forming a scribe line on the upper and lower face of a mother substrate (G) by arranging upper and lower scribing wheels (301, 401) to be offset from each other in the direction of scribing and moving the scribing wheels along with a sealant (SL); adjusting the movement of the scribing wheels (301, 401), wherein the scribing wheels pass through the top of different scribe lines (LV1, LV2) approximately at the same time; and forming scribe lines on the upper and the lower face of the mother substrate (G) by arranging the upper and lower scribing wheels (301, 401) to be offset from each other in the direction of scribing, when the scribing wheels pass through the scribe lines (LV1, LV2), and moving the scribing wheels along with the sealant. |
