METHOD FOR MANUFACTURING ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device capable of reducing the incidence of defects without lowering the number of electronic devices manufactured per wafer.SOLUTION: A method for manufacturing an electronic device comprises the steps of: processing a surface of a first wafer; bonding a surface of a second wafer to the processed surface of the first wafer; thinning the first wafer by polishing a rear surface of the first wafer on the side opposite to the bonding surface of the second wafer; forming a groove having a prescribed width and a uniform depth along a peripheral part of the rear surface of the thinned first wafer using a dicing blade; attaching a protection layer onto the rear surface of the first wafer on which the groove is formed via an adhesion layer; and polishing the rear surface of the second wafer on the side opposite to the surface to which the protection layer is attached.SELECTED DRAWING: Figure 1