发明名称 SUBSTRATE PROCESSING METHOD, PROGRAM, COMPUTER STORAGE MEDIUM, AND SUBSTRATE PROCESSING SYSTEM
摘要 PROBLEM TO BE SOLVED: To appropriately form a prescribed pattern on a substrate in substrate processing which uses a block copolymer containing a hydrophilic polymer and a hydrophobic polymer.SOLUTION: A method for processing a wafer using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer comprises the steps of: forming a prescribed resist pattern on the wafer (step S3); forming a thin film for suppressing deformation of the resist pattern on a surface of the resist pattern (step S4); applying the block copolymer to the wafer after forming the thin film (step S5); and phase-separating the block copolymer into the hydrophilic polymer and the hydrophobic polymer.SELECTED DRAWING: Figure 6
申请公布号 JP2016066681(A) 申请公布日期 2016.04.28
申请号 JP20140194167 申请日期 2014.09.24
申请人 TOKYO ELECTRON LTD 发明人 MURAMATSU MAKOTO;TOMITA TADATOSHI;GENJIMA HISASHI;YO HAJIME;KITANO TAKAHIRO
分类号 H01L21/027;C23C14/10;C23C14/34;C23C16/14;C23C16/34;H01L21/31;H01L21/316 主分类号 H01L21/027
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