发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that is useful for forming a black matrix layer and that exhibits high resistance in a photosensitive resin layer formed therefrom and excellent lithography characteristics in patterning.SOLUTION: The photosensitive resin composition comprises a resin (A) having a cardo skeleton, a photopolymerization initiator (B), a silane coupling agent (C), and a colorant (D). The colorant (D) comprises carbon black coated with an epoxy resin.SELECTED DRAWING: None
申请公布号 JP2016065991(A) 申请公布日期 2016.04.28
申请号 JP20140195198 申请日期 2014.09.25
申请人 TOKYO OHKA KOGYO CO LTD 发明人 TADOKORO KEISUKE;ISHIKAWA TATSURO;KINOSHITA TETSUO
分类号 G03F7/027;G02B5/20;G03F7/004;G03F7/075 主分类号 G03F7/027
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