| 发明名称 |
BASE POLYMER FOR HOT-MELT ADHESIVE AGENT, AND HOT-MELT ADHESIVE AGENT |
| 摘要 |
Provided is a hot-melt adhesive which satisfies both solidification rate and adhesiveness. A base polymer for a hot-melt adhesive which satisfies the following (1) and (2): (1) a modulus of elasticity in tension at 23° C. is 400 MPa or less; and (2) a semi-crystallization time at 23° C. is 20 minutes or less. |
| 申请公布号 |
US2016115360(A1) |
申请公布日期 |
2016.04.28 |
| 申请号 |
US201414894152 |
申请日期 |
2014.05.27 |
| 申请人 |
IDEMITSU KOSAN CO., LTD. |
发明人 |
HASHIMA Kazuhiro;TAKEBE Tomoaki;MINAMI Yutaka;INOUE Masao;KOBAYASHI Kenji |
| 分类号 |
C09J123/12;A61L15/58;A61L15/24;C09J5/00 |
主分类号 |
C09J123/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1: A base polymer for a hot-melt adhesive which satisfies the following (1) and (2):
(1) a modulus of elasticity in tension at 23° C. is 400 MPa or less; and (2) a semi-crystallization time at 23° C. is 20 minutes or less. |
| 地址 |
Tokyo JP |
