发明名称 ULTRATHIN MICROCHIP STRUCTURE
摘要 An ultrathin microchip structure at least includes a flexible base material. The flexible base material includes an installation surface and a printed surface at an upper surface and a lower surface thereof, respectively. The installation surface is provided with one set or multiple sets of integrated circuits. Each of the integrated circuits at least includes a chip and at least one set of transceiver antenna. One or both of the installation surface and the printed surface of the flexible base material is/are applied with a nanometer film layer having characteristics of being waterproof, dustproof, wear resistant, and penetrable by the RF signal, thereby effectively simplifying the present invention as an ultrathin microchip.
申请公布号 US2016114180(A1) 申请公布日期 2016.04.28
申请号 US201514681815 申请日期 2015.04.08
申请人 TSENG Jason;WU Harry;LIAO Jing-Wen;TSENG Luca;TSENG Lucy 发明人 TSENG Jason;WU Harry;LIAO Jing-Wen;TSENG Luca;TSENG Lucy
分类号 A61N1/40 主分类号 A61N1/40
代理机构 代理人
主权项 1. An ultrathin microchip structure, comprising: a flexible base material, having an installation surface and a printed surface, the installation surface being provided with one set or multiple sets of integrated circuits; and at least one integrated circuit, each having at least one chip and at least one set of transceiver antenna; wherein, one or both of the installation surface and the printed surface of the flexible base material is/are applied with at least one nanometer film layer penetrable by a radio-frequency (RF) signal.
地址 New Taipei City TW