| 摘要 |
A diaphragm structure of a sounding apparatus. The diaphragm structure comprises: a thin-film layer (11); a first circuit thin-film layer (21), fixed on a first side (111) of the thin-film layer (11) by means of a first electrolytic bonding layer (41); a second circuit thin-film layer (22), fixed on a second side (112) of the thin-film layer (11) by means of a second electrolytic bonding layer (42); multiple holes (5), passing through the first circuit thin-film layer (21), the thin-film layer (11) and the second circuit thin-film layer (22); and multiple conductive layers (51), disposed on inner circumferential walls of the holes (5) and in contact with the first circuit thin-film layer (21) and the second circuit thin-film layer (22). According to the diaphragm structure, an electrolytic bonding mode is used to replace traditional back adhesive to fix circuit thin-film layers on two sides of a thin-film layer, and accordingly, the thickness of the diaphragm structure is greatly reduced. |
