| 摘要 |
A wafer is divided along a plurality of crossing division lines to obtain a plurality of individual devices. The division lines are formed on the front side of the wafer to define a plurality of separate device regions. An adhesive film is applied to the back side of the wafer and the other side of the adhesive film is attached to a dicing tape composed of a base sheet and an ultraviolet curable adhesive layer formed on the base sheet. The adhesive film is attached to the ultraviolet curable adhesive layer of the dicing tape. Ultraviolet light is applied to the dicing tape to thereby cure the adhesive layer. A rotating cutting blade cuts the wafer together with the adhesive film along the division lines, dividing the wafer into the individual devices. The cutting blade is positioned so that its cutting edge cuts into the cured adhesive layer. |
