| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering apparatus allowing formation of a transparent conductive film having a low specific resistance with a small variation in an in-plane direction.SOLUTION: A sputtering apparatus forms a transparent conductive film on a flexible substrate S moving in a longitudinal direction. In a direction viewing a side cross section of the substrate, a target 10 arranged facing one surface constituting a film deposition surface of the substrate includes a magnetic circuit 12 to form multiple erosion parts a, b in the target. The multiple erosion parts of the target being arranged along a propagation direction of the substrate. When a travelling trajectory of a particle ejected from the erosion parts in sputtering has an angle θ(θ, θ, θ,θ)[deg] to a normal line of a surface of the target, a shield plate 15 is arranged between the target and the substrate, and the θ satisfies 65 or less to any of the erosion parts.SELECTED DRAWING: Figure 2 |
