| 摘要 |
PROBLEM TO BE SOLVED: To provide: a two-layered copper-clad laminate with high dimensional stability, which is arranged so that its sagging is suppressed; a method for manufacturing such a two-layered copper-clad laminate; and a flexible wiring board arranged by use of such a two-layered copper-clad laminate.SOLUTION: A method for manufacturing a two-layered copper-clad laminate arranged by laminating, on at least one surface of a polyimide film, a base metal layer and a copper layer without an adhesive comprises a dehydration step for performing a dehydration process on a polyimide film, a dry-plating step for performing a dry-plating process on the dehydrated polyimide film, and a wet-plating step for performing a wet-plating process the polyimide film subjected to the dry-plating process, where these steps are performed while conveying the polyimide film by a roll-to-roll method. The polyimide film includes an imide bond including 4,4'-diaminodiphenylether and pyromellitic dianhydride. In the dehydration step or the dry plating step, or the dehydration step and the dry plating step, the tension when conveying the polyimide film to the breaking strength of the polyimide film is 0.6-1.9% in the dehydration process, and 3.2-4.5% in the dry plating process.SELECTED DRAWING: Figure 1 |
