METAL-FOIL-CLAD SUBSTRATE, CIRCUIT BOARD, AND SUBSTRATE WITH HEAT-GENERATING BODY MOUNTED THEREON

摘要

This metal-foil-clad substrate is used for forming a circuit board with a heat-generating body mounted thereon. This metal-foil-clad substrate comprises: a flat-plate-shaped metal foil; a resin layer that has insulating properties and that is formed on one surface of the metal foil; a heat-dissipating metal plate that dissipates heat generated by a heat-generating body, the heat-dissipating metal plate being formed so as to correspond, in a planar view of the resin layer, to a first region encompassing a region where the heat-generating body is mounted on the opposite surface of the resin layer from the metal foil; and an insulating part formed so as to correspond to at least a portion of a second region on the opposite surface of the resin layer from the metal foil excluding the first region. The insulating part is constituted by a cured product of a first resin composition including a first thermosetting resin. The resin layer is constituted by a cured product or a solidified product of a second resin composition that includes a resin material and that is different from the first resin composition. The heat-dissipating metal plate has at least one protrusion that protrudes from a surface that is joined with the insulating part.