THERMOSETTING RESIN COMPOSITION, RESIN FILM WITH CARRIER, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device.SOLUTION: A thermosetting resin composition for forming a solder resist is provided, which comprises an epoxy resin and silica particles. When a resin film obtained by using the thermosetting resin composition is subjected to a dynamic viscoelasticity test under the conditions of 62.83 rad/sec measurement frequency and 3°C/min temperature elevation rate, a minimum complex viscosity of the resin film at 50 to 150°C is 0.1 Pa sec or more and 5000 Pa sec or less.SELECTED DRAWING: Figure 1