| 发明名称 |
METHOD OF MANUFACTURING PRINTED-CIRCUIT BOARD ASSEMBLY |
| 摘要 |
A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit. |
| 申请公布号 |
US2016120039(A1) |
申请公布日期 |
2016.04.28 |
| 申请号 |
US201514920513 |
申请日期 |
2015.10.22 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
BANG Jung-Je;Kim Mi-Jin;Lee Sae-Bom;Han Hyun-Joo;Kim Kun-Tak |
| 分类号 |
H05K3/32;H05K3/34 |
主分类号 |
H05K3/32 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a printed circuit board assembly, the method comprising:
applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit. |
| 地址 |
Gyeonggi-do KR |
