发明名称 PLUGGABLE LGA SOCKET FOR HIGH DENSITY INTERCONNECTS
摘要 Embodiments provide for a method for pluggable Land Grid Array (LGA) socket for high density interconnects. A method includes inserting an electrical-to-optical transceiver into an opening of a channel housing that is positioned above a land grid array connector located on an electrical package. After the electrical-to-optical transceiver is inserted into the channel housing, a tapered opening remains between an upper portion of the channel housing above the electrical-to-optical transceiver, wherein a gap of the tapered opening decreases progressively starting from the opening. The method includes inserting a conductive wedge into the gap of the tapered opening prior to communications through the electrical-to-optical transceiver between a component on the electrical package and a component external to the electrical package.
申请公布号 US2016118760(A1) 申请公布日期 2016.04.28
申请号 US201514833379 申请日期 2015.08.24
申请人 International Business Machines Corporation 发明人 Benner Alan F.;Fasano Benjamin Vito;Fortier Paul Francis;Toy Hilton T.
分类号 H01R43/20 主分类号 H01R43/20
代理机构 代理人
主权项 1. A method comprising: inserting an electrical-to-optical transceiver into an opening of a channel housing that is positioned above a land grid array connector located on an electrical package, wherein after the electrical-to-optical transceiver is inserted into the channel housing, a tapered opening remains between an upper portion of the channel housing above the electrical-to-optical transceiver, wherein a gap of the tapered opening decreases progressively starting from the opening; and inserting a conductive wedge into the gap of the tapered opening prior to communications through the electrical-to-optical transceiver between a component on the electrical package and a component external to the electrical package.
地址 Armonk NY US