发明名称 |
PLUGGABLE LGA SOCKET FOR HIGH DENSITY INTERCONNECTS |
摘要 |
Embodiments provide for a method for pluggable Land Grid Array (LGA) socket for high density interconnects. A method includes inserting an electrical-to-optical transceiver into an opening of a channel housing that is positioned above a land grid array connector located on an electrical package. After the electrical-to-optical transceiver is inserted into the channel housing, a tapered opening remains between an upper portion of the channel housing above the electrical-to-optical transceiver, wherein a gap of the tapered opening decreases progressively starting from the opening. The method includes inserting a conductive wedge into the gap of the tapered opening prior to communications through the electrical-to-optical transceiver between a component on the electrical package and a component external to the electrical package. |
申请公布号 |
US2016118760(A1) |
申请公布日期 |
2016.04.28 |
申请号 |
US201514833379 |
申请日期 |
2015.08.24 |
申请人 |
International Business Machines Corporation |
发明人 |
Benner Alan F.;Fasano Benjamin Vito;Fortier Paul Francis;Toy Hilton T. |
分类号 |
H01R43/20 |
主分类号 |
H01R43/20 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method comprising:
inserting an electrical-to-optical transceiver into an opening of a channel housing that is positioned above a land grid array connector located on an electrical package,
wherein after the electrical-to-optical transceiver is inserted into the channel housing, a tapered opening remains between an upper portion of the channel housing above the electrical-to-optical transceiver, wherein a gap of the tapered opening decreases progressively starting from the opening; and inserting a conductive wedge into the gap of the tapered opening prior to communications through the electrical-to-optical transceiver between a component on the electrical package and a component external to the electrical package. |
地址 |
Armonk NY US |