SUBSTRATE TREATING APPARATUS AND SUBSTRATE CLEANING METHOD

摘要

Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a housing defining a space for treating a substrate therein, a spin head supporting and rotating the substrate in the housing, a spray unit including a first nozzle member for spraying a first treating solution on the substrate placed on the spin head, and a controller controlling the spray unit. The controller sprays the first treating solution while moving the first nozzle member between edge and center regions of the substrate and above the substrate. The controller differently adjusts a first height at which the first treating solution is sprayed on the edge region of the substrate and a second height at which the first treating solution is sprayed on the center region of the substrate.

主权项

1. A substrate treating apparatus comprising:
a housing defining a space for treating a substrate therein; a spin head supporting and rotating the substrate in the housing; a spray unit including a first nozzle member for spraying a first treating solution on the substrate placed on the spin head; and a controller controlling the spray unit, wherein the controller sprays the first treating solution while moving the first nozzle member between edge and center regions of the substrate and above the substrate, and wherein the controller differently adjusts a first height at which the first treating solution is sprayed on the edge region of the substrate and a second height at which the first treating solution is sprayed on the center region of the substrate.