PHOTOSENSITIVE ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

A photosensitive adhesive composition of the present invention is used for bonding a semiconductor element and a member to which the semiconductor element is to be bonded. The post-curing photosensitive adhesive composition has an elastic modulus of 2.0 to 3.5 GPa at a temperature of 25 °C, the pre-curing photosensitive adhesive composition has an elastic modulus at a temperature of 25 °C that is 70 to 120 % of the elastic modulus of the post-curing photosensitive adhesive composition at a temperature of 25 °C, the pre-curing photosensitive adhesive composition after having gone through an etching process and an ashing process has an adhesion force to a semiconductor element of 20 to 200 N at a temperature of 25 °C, and the pre-curing photosensitive adhesive composition has a minimum melt viscosity of 20 to 500 Pa･s at a temperature of 100 to 200 °C.