METHOD FOR FORMING A CONDUCTIVE ADHESIVE AT BONDING OBJECT

摘要

Provided is a technique of manufacturing a conductive adhesive having high electric conductivity and high adhesion by having high solder ball formation rate for adhesion. The method for forming a conductive adhesive on a target according to the present invention comprises the following steps: manufacturing an adhesive film having at least one cross section formed with a polymer compound and a conductive material, wherein the polymer compound and the conductive material form distinguishable patterns; manufacturing a film by cutting the adhesive film for the cross section to be the contact surface; placing the manufactured film to a contact part between the target for the cross section to be in contact with the contact part; and bonding the film to the contact part of the target to allow the conductive material to form a solder ball on the contact part by thermal compression of the film.