| 摘要 |
PROBLEM TO BE SOLVED: To provide an art to inhibit grease leakage due to bleed-out and the like.SOLUTION: A semiconductor device disclosed in the present specification comprises: a power card 10 having a housing 13 in which a semiconductor element is encapsulated and a heat sink 16 exposed on a surface 13a of the housing 13; and a cooling member 6 layered on the surface 13a of the housing 13 across a grease. A projecting thread group 41 which extends from one edge 16a to the other edge 16b of a heat sink overlapping region where the heat sink 16 and the cooling member 6 overlap each other when viewed from a layered direction is provided on the surface 13a of the housing 13 and on one of faces of the cooling member 6, which are opposite to each other. Further, grooves are provided on the one of the faces opposite to each other in a housing overlapping region which is shared by a region outside the heat sink overlapping region and a region where the housing 13 and the cooling member 6 overlap each other. The grooves are a groove 43 and a groove 44 which extend one edge 16a and the other edge 16b, respectively. The groove 43 and the groove 44 are closed in the housing overlapping region when viewed from the layered direction.SELECTED DRAWING: Figure 5 |
