| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing the same capable of suppressing fluctuation in pressure of an air-tight chamber and reduction in bonding strength, and further, of suppressing increase in size.SOLUTION: In a semiconductor device, a first substrate 10 is bonded with a second substrate 21 and an insulating film 22, and an air-tight chamber 31 is configured to include a space between the first substrate 10 and a hollow part 20c of the second substrate 21 and the insulating film 22. In the semiconductor device, a sealing chamber 32 is configured between the second substrate 20 and the first substrate 10, and such a groove part 20d that a region bonded with one surface 20c of the second substrate 20 on one surface 10a of the first substrate 10 is not divided and that a bonding region become continuous is formed.SELECTED DRAWING: Figure 1 |
