| 发明名称 |
THERMOSETTING RESIN COMPOSITION, METHOD OF PRODUCING THERMAL CONDUCTIVE SHEET, AND POWER MODULE |
| 摘要 |
A thermosetting resin composition containing a thermosetting resin and an inorganic filler, in which the inorganic filler contains secondary sintered particles (A) formed of primary particles of boron nitride, which have an aspect ratio of 10 to 20, and secondary sintered particles (B) formed of the primary particles of boron nitride, which have an aspect ratio of 2 to 9. The thermosetting resin composition can produce a thermal conductive sheet that has excellent filling property of the inorganic filler, and excellent thermal conductivity, adhesiveness and electrical insulating properties. |
| 申请公布号 |
US2016115343(A1) |
申请公布日期 |
2016.04.28 |
| 申请号 |
US201414896235 |
申请日期 |
2014.01.10 |
| 申请人 |
MITSUBISHI ELECTRIC CORPORATION |
发明人 |
TAKAHARA Mariko;MIMURA Kenji;NAKAMURA Yurie;MASAKI Motoki |
| 分类号 |
C09D163/00;B29C41/02;H01L21/48;B29C41/00;C08K3/38;H01L23/373 |
主分类号 |
C09D163/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A thermosetting resin composition containing a thermosetting resin and an inorganic filler, wherein the inorganic filler contains secondary sintered particles (A) formed of primary particles of boron nitride which have an aspect ratio of 10 to 20, and secondary sintered particles (B) formed of primary particles of boron nitride which have an aspect ratio of 2 to 9. |
| 地址 |
Chiyoda-ku, Tokyo JP |
