发明名称 HEAT PUMP SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a heat pump system capable of performing effective cooling against an electric device under application of refrigerant temperature across an expansion valve at a cooling heat source for the electric device and stably keeping function of the electric device.SOLUTION: A heat pump system 10 comprises a freezing cycle 17 constituted by a compressor 11, a condenser 12, an expansion valve 13, an evaporator 14 and a four-way valve 15 for changing-over a cooling operation and a heating operation connected through a refrigerant pipe 16; and an electric device 18 used for operation control of the freezing cycle 17. The heat pump system 10 is constituted in such a way that each of the heat radiation segments 20a, 20b of the heat pipes 21a, 21b is installed at a refrigerant pipe 16 across the expansion valve 13, heat receiving parts 22a, 22b of the heat pipes are installed at the electric device 18 to constitute the electric device cooling system 24.SELECTED DRAWING: Figure 1
申请公布号 JP2016065656(A) 申请公布日期 2016.04.28
申请号 JP20140193667 申请日期 2014.09.24
申请人 TOSHIBA CARRIER CORP 发明人 TAKAYAMA TSUKASA;ZUSHI TAKAHIRO;ASARI SHUN;TANAKA MAKOTO
分类号 F25B1/00;F25B13/00;F25B41/04;F25B41/06;F28D15/02;H05K7/20 主分类号 F25B1/00
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