| 摘要 |
PROBLEM TO BE SOLVED: To provide a partial plating method capable of making film thickness distribution of plating in a width direction of respective belt-state plating areas almost even, when performing electrical plating in a stripe-state to a band-state strip material, and a device therefor.SOLUTION: Band-state strip materials 24 on which non-plating areas are masked so that, plural band-state plating areas and non-plating areas are extended along a longitudinal direction and alternately arranged in a width direction on at least one of surfaces, are continuously fed in a plating bath, and current is flown between the strip materials in the plating bath and an anode, for performing electrical plating to at least one surface of the strip materials, in a stripe-state, in a partial plating method. Plural band-state block plates 38 (for band-state plating area peripheral edge part) are arranged between the plating areas and anode so that, the block plates 38 face the peripheral edge part extending in the longitudinal direction of each of plural band-state plating areas in the plating bath, then current density between the peripheral edge part extending in the longitudinal direction of each of the plural band-state plating areas in the plating bath and the anode, is reduced.SELECTED DRAWING: Figure 1C |
