发明名称 MASKING FILM FOR PLATING
摘要 PROBLEM TO BE SOLVED: To provide a masking film for plating which has excellent followability to a circuit pattern at high temperature, has excellent soaking preventing properties of a plating solution, hardly causes burrs and has excellent punchability, and has excellent releasability at ordinary temperature after plating.SOLUTION: A masking film 10 for plating has an adhesive layer 2 on one surface of a substrate film 1. The adhesive layer 2 has a glass transition temperature of 10 to 35°C and is formed of at least (A) an acrylic resin and (B) a crosslinking agent, and at least (A) the acrylic resin is a copolymer composed of a component containing a monomer having (A-1) ethyl methacrylate, (A-2) (meth)acrylate having a hydroxyl group and an alkyl group having 2 to 8 carbon atoms, and (A-3) an ethylenic unsaturated double bond.SELECTED DRAWING: Figure 1
申请公布号 JP2016065189(A) 申请公布日期 2016.04.28
申请号 JP20140196242 申请日期 2014.09.26
申请人 SOMAR CORP 发明人 DEMURA FUMIKO;NAKAYAMA MASANORI;HAYASHI TORAO
分类号 C09J7/02;B32B27/30;C09J131/04;C09J133/00;C09J133/04;C09J133/18;C25D5/02 主分类号 C09J7/02
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