发明名称 RESIN COMPOSITION AND MOLDED BODY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a resin composition which has improved flexibility and formability and is less likely to adsorb an active ingredient such as chemical and lotion under high-temperature environment under the consideration of a conventional defect; and a molded body using the same.SOLUTION: A resin composition contains a resin in which an olefin-based compatibilizer (B) and a polycarbodiimide compound (C) are chemically bonded to both molecular ends of isophthalic acid-modified polyethylene terephthalate (A) by melting and mixing. The resin composition can be used for a film, a sheet, a laminate, a multilayer film, a multilayer sheet, a container, a molded body and the like.SELECTED DRAWING: None
申请公布号 JP2016065181(A) 申请公布日期 2016.04.28
申请号 JP20140195943 申请日期 2014.09.26
申请人 FUJIMORI KOGYO CO LTD 发明人 KAJIMA KOSUKE;KANAZAWA ASAKO;YOSHIDA MIHOKO
分类号 C08G63/91;B32B27/36 主分类号 C08G63/91
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