| 摘要 |
The present technique relates to a solid-state image pickup element and an electronic device for enabling the picture quality of solid-state image pickup elements to be improved. A solid-state image pickup element comprises a photoelectric conversion part for performing photoelectric conversion of an incident light that is incident from a predetermined incidence surface. The solid-state image pickup element further comprises a wiring which is arranged on a bottom side, i.e., a surface opposite to the incidence surface of the photoelectric conversion part and in which protrusion patterns are formed on the surface opposed to the photoelectric conversion part. The present technique can be applied to, for example, solid-state image pickup elements, such as CMOS image sensors, and to electronic devices each having a solid-state image pickup element. |
