MEMBER FOR SEALING SEMICONDUCTOR, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a member for sealing a semiconductor, a semiconductor device manufacturing method using the same and a semiconductor device.SOLUTION: A semiconductor device manufacturing method comprises: a step of temporarily fixing one or more semiconductor elements each having an active surface and a passive surface at the opposite side to the active surface to a support body having a temporarily fixing layer so that the temporarily fixing layer and the active surface of the semiconductor element adhere to each other; a step of sealing a temporarily fixed semiconductor element with a semiconductor sealing member and forming a first insulation layer covering the passive surface side of the semiconductor element; a step of exfoliating the support body and the temporarily fixing layer from the semiconductor element and the first insulation layer for sealing the semiconductor element to obtain the semiconductor element having the exposed active surface and the first insulation layer sealing the semiconductor element; and a step of forming a second insulation layer having an opening reaching the active surface of the semiconductor element at the semiconductor element having the exposed active surface and the active surface side of the first insulation layer sealing the semiconductor element.SELECTED DRAWING: Figure 4