| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing pad where rigidity is lowered by the rise of polishing temperature due to the accumulation of polishing chips, that is, the rigidity is made small at the final stage of a polishing work accumulated with the polishing chips.SOLUTION: In a polishing pad having a polishing layer consisting of a polyurethane resin, especially foamed polyurethane, the polishing layer is inactive to an isocyanate group, a hydroxyl group and an amino group and contains a non-reactive substance having a melting point or a softening point of 50-80°C.SELECTED DRAWING: None |
