发明名称 WORK POLISHING DEVICE AND WORK PRODUCING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a producing method of work polishing device and work producing method capable of preventing reduction in quality of work quality during polishing step.SOLUTION: There is provided a device for polishing a work, which comprises rotation base board comprising a lower base board 12 in which a polishing pad 12a is attached on its surface and which comprises at least 2 first annular walls 12b on its backside and a receiving board comprising a bottom plate 13a recovering polishing slurry supplied to the polishing pad 12a at a position below the lower base board and at least 3 second annular walls 13b. The device supplies polishing slurry with the work loaded on the polishing pad 12a to polish the work. The device comprises a block structure L which is constructed with the first annular walls 12b and the second annular walls 13b between the lower base board 12 and the receiving board to suppress invasion of the polishing slurry into rotation mechanism of the lower base board. The device comprises a slurry outlet 23 discharging polishing slurry invaded into the block structure L and a fixation prevention liquid supplying means 24 supplying fixation prevention liquid preventing fixation of the invaded polishing slurry into block structure L.SELECTED DRAWING: Figure 3
申请公布号 JP2016064478(A) 申请公布日期 2016.04.28
申请号 JP20140195326 申请日期 2014.09.25
申请人 SUMCO CORP 发明人 MATSUDA TAKEHIKO
分类号 B24B37/34;H01L21/304 主分类号 B24B37/34
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