SOLDER CHIP, METHOD FOR MANUFACTURING GLASS SUBSTRATE WITH TERMINAL BY USE OF SOLDER CHIP

摘要

PROBLEM TO BE SOLVED: To provide a solder chip which can improve bonding yield.SOLUTION: A solder chip 10 used for bonding of a conductive film 30 formed on a glass substrate 20 and a terminal 40 has: a first surface 11 which is brought into surface contact with a surface of the conductive film 30 facing the terminal 40, and on which a dummy recess 14 corresponding to an accommodation recess 13 is formed; and a second surface 12 which is brought into surface contact with a surface of the terminal 40 facing the conductive film 30, and on which an accommodation recess 13, which accommodates a projection 42 formed on the surface of the terminal 40 facing the conductive film 30, is formed.SELECTED DRAWING: Figure 2