发明名称 IN-VEHICLE CAMERA
摘要 A front imaging portion captures the front side of a vehicle. A rear imaging portion captures the interior or the rear side of the vehicle. A casing houses the front imaging portion and the rear imaging portion. A heat sink is located between the front imaging portion and the rear imaging portion in the casing to radiate heat inside the casing. A fixing portion is located on the outer surface of the casing and between a first end and a second end of the heat sink and separated from the heat sink to fix the casing to the vehicle. An intake is located adjacent to the fixing portion at the first end to be open toward the heat sink. An outlet is located adjacent to the fixing portion at the second end to be open toward the heat sink while facing the intake with the fixing portion interposed therebetween.
申请公布号 US2016119514(A1) 申请公布日期 2016.04.28
申请号 US201614991450 申请日期 2016.01.08
申请人 JVC KENWOOD CORPORATION 发明人 SUGIMURA Yukio;SASAKI Yoji;OKUNISHI Tsuyoshi;SHINOHARA Seiji;SEKINE Takao;NEGAMI Satoshi;TSUKAMOTO Fumio;YAMAMOTO Hirofumi
分类号 H04N5/225;G03B17/55;B60R25/30;G06K9/00 主分类号 H04N5/225
代理机构 代理人
主权项 1. An in-vehicle camera comprising: a front imaging portion configured to capture a front side of a vehicle; a rear imaging portion configured to capture an interior or a rear side of the vehicle; a casing housing the front imaging portion and the rear imaging portion; a heat sink located between the front imaging portion and the rear imaging portion in the casing to radiate heat inside the casing; a fixing portion located on an outer surface of the casing and between a first end and a second end of the heat sink and separated from the heat sink to fix the casing to the vehicle; an intake located adjacent to the fixing portion at the first end of the heat sink to be open toward the heat sink; and an outlet located adjacent to the fixing portion at the second end of the heat sink to be open toward the heat sink while facing the intake with the fixing portion interposed therebetween.
地址 Yokohama-shi JP