| 摘要 |
[Problem] To provide a surface protective sheet which is capable of inhibiting warping of a wafer after the sheet is peeled, and which exhibits sufficient antistatic performance. [Solution] This surface protective sheet is used when grinding the rear surface of a semiconductor wafer having a circuit formed on the front surface, and is provided with: a base material comprising a support film and an antistatic coating layer which includes an inorganic conductive filler and a cured product of a curable resin (A); and an adhesive layer. The stress relaxation percentage of the base material after 1 minute at 10% elongation is at least 60%. The Young's modulus of the base material is 100-2000 MPa. |
