| 摘要 |
The present invention provides a method for machining an adhesion belt and a wafer using the adhesion belt, wherein the adhesion belt can inhibit static electricity, and is used for supporting the wafer, and the wafer forms a plurality of devices in a manner of being divided by a predetermined separation line on the surface of the wafer, and the wafer is characterized by comprising an adhesion layer laminated on the surface of the thin sheet shaped substrate, and an anti-electrification layer laminated at the back side of the thin sheet shaped substrate. |
