| 摘要 |
<P>PROBLEM TO BE SOLVED: To make a vibration member of an oscillation device thinner. <P>SOLUTION: A vibration member 10 is deposited on a base material 100 by using, for instance, a sputtering method. Then a first electrode layer 26 is deposited on the vibration member 10 by using, for instance, the sputtering method. Then a piezoelectric layer 22 is deposited on the first electrode layer 26 by using, for instance, the sputtering method. Then a second electrode layer 24 is deposited on the piezoelectric layer 22 by using, for instance, the sputtering method. Further, the piezoelectric layer 22 may be formed by using a spraying method or an aerosol deposition method. <P>COPYRIGHT: (C)2012,JPO&INPIT |
