MANUFACTURING METHOD OF PLATING LAYER HAVING MICROPOROUS STRUCTURE

摘要

The present invention relates to a manufacturing method of a plating layer having a microporous structure, comprising: (Step 1) a step of forming a first copper plating layer on a heat sink by performing a primary electro-plating of the heat sink in a plating solution; and (Step 2) a step of forming a second copper plating layer on the heat sink by performing a secondary electro-plating on the heat sink with the first copper plating layer formed in the plating solution. The present invention forms a 3D-type copper plating layer having a three-dimensional microporous structure in a shape of a pillar, and has a broader surface area. Accordingly, the cooling efficiency is able to be maximized, and the attaching force to the plated body is strengthened.